Xwinsys 100
Xwinsys 100

APPLICATIONS FEATURES  & CONFIGURATION
Bump application – composition and height
TSV void inspection using our non-destructive solution
UBM / RDL thickness monitoring
Light elements detection methodology
Alloy Composition

- 3D localized structures
- No edge exclusion
- 3D Microscope
- High resolution 2D Microscope
- Micro X-Ray Fluorescence
- Ease of use