The MC600i offers increased accuracy, enables cleaving of smaller
wafer segments and dies, and allows cleaving as close as 0.5mm to
a sample/wafer edge.

ystem Highlights:
•Fully Automatic and Programmable Process
•Fast Cleave Process within 3 Minutes
•Small Wafer Segment Capability
•Edge Cleaving - as near as 0.5mm to sample/wafer edge
•Cryo-Cooling Mechanism (LN2)
•High Magnification Optics (7500x)


•Turnaround Time Drastically Reduced
•Improves Yield Analysis
•Improves Characterization
•Improves and Enhances SEM and FIB Utilization
•High Productivity
•Low Cost of Ownership