Reactive Ion Etching System
Wide range of applications
• III-V etch processes
• Silicon Bosch and cryo-etch processes
• Diamond Like Carbon (DLC) deposition
• SiO2 and quartz etch
• Failure analysis dry etch de-processing using the specially-configured PlasmaPro NGP FA tools, with RIE, dual-mode RIE/PE and ICP processes ranging from     packaged chip and die etch through to full 200mm wafer etch
• High quality PECVD of silicon nitride and silicon dioxide for photonics, dielectric layers, passivation and many other uses
• Hard mask deposition and etch for high brightness LED production