半導體_靜態或動態接觸角測量&表面濕潤程度&元件表面的自由能
~GENERAL SOFTWARE
3 user levels
-connection to SPC via network interface card
-operating system Windows XP/7
-automatic loadport recognition
-automatic recognition of slot occupancy
-automatic measurement recipes assigned to certain load port (recipe mix up between different wafer sizes is avoided)
-slot integrity is warranted
-notching before measurement
-Measurement data will be stored on local disc – any backup storage on network server will be organized by customer
-LAN compatible
-Client software for result evaluation on office PC is included
-Manual operation mode (via joystick)
-MEASUREMENT GENERAL
-Automatic, motorized dispense System
-Syringe for one media (DI-water)
-Tank with 10 ml media stock
-Programmable droplet size
-Automatic placement of the droplet on the wafer, movement for droplet placement is programmable
-Easy disassembly/cleaning of the dispense system
-System capable for measurements with second liquid
 
Image: Tool inside setup showing wafer roboter and dispensation system
MEASUREMENT
-Tool/Software supports free definable measurement maps
-The whole wafer surface for 12« must be in reach for the dispense system (excluding edge area)
-Complete automatic measurement (FOUP -› droplet placement -› measurement -› droplet removal -› FOUP)
-GENERAL HARDWARE
-Wafer handling capability for 12« wafer / and or 8« wafers
-System guarantees slot integrity
-Manual focus system, OEG provides detailed instruction for focus adjustment
-OEG provides concept for maintenance, spare parts, complete users guide
-OEG provides instruction for change of syringe
-Wafer chuck only defined by measurement characteristics
-Air pressure, vacuum, exhaust is provided by customer
-Customer provides 300mm wafers plus FOUPs for development system setup
-After measurement liquid will be evaporated by hotplate (optional)
-Work place contains keyboard and mouse

-TOOL CONFIGURATION
Configuration – unit description:
 
1) Wafer handling system
-3-axis wafer handling robot
-FOUP opening system 300 mm
-Loadport (OCL) 200 mm
-Laser scanner
-Vacuum endeffector
-Notching system

~SURFTENS WH300主要功能
基於SURFTENS系列,OEG開發出了應用於半導體工業的,專業表面張力檢測分析儀器,能實現自動裝載與測量的完美結合(FOUP→裝載→滴液→測量→移液→FOUP)。其主要的測量與分析功能如下:
 
靜態或動態接觸角測量
固體表面濕潤程度
固體及元件表面的自由能

操作軟體
SURFTENS軟體支援Windows XP/7作業系統,支援通過網卡連接到SPC,並提供了三種不同的使用權限級別。軟體能自動識別裝載埠、插槽分配情況,並且在測量前自動開槽。另外,使用者還能在軟體裡自由編輯測量範本。點擊開始,軟體會根據所選擇的測量範本自動檢測。
 
檢測後,測量資料會保存在本地硬碟裡,使用者可以在配備的PC上直接操作分析和處理資料。因為相容LAN,資料也可以上傳至網路服務器,供其他電腦訪問使用。

滴液系統
SURFTENS WH300採用和SURFTENS automatic類似的自動滴液系統。整個滴液裝置由電機驅動,受操作軟體控制,能夠定位到晶圓的任意一點。系統支援多種測量液體,單只注射器(標配10ml)只支持一種液體,比如去離子水。用戶可以自訂滴液容積,滴液位置以及滴液過程。此外,整個滴液系統拆卸簡單,便於清洗或更換。